Future Development — Outlook (Next 12–24 Months)
- Liquid Cooling Standardization: Rapid shift toward facility‑level liquid distribution (CDUs, warm‑water loops) and rack envelopes above 150kW.
- Modular AI Campuses: Prefabricated power/cooling blocks and white‑space modules staged for incremental 10–50MW expansions.
- Power & Grid Strategy: More onsite generation/energy storage and microgrid readiness to mitigate interconnection timelines.
- Optical‑First Cabling: Designs anticipating CPO/optical I/O adoption for GPU‑to‑GPU links and memory fabrics.
- Delivery Models: EPC + managed services / availability SLAs; increased use of long‑lead vendor frameworks.
This outlook is an analytical forecast based on AI/HPC infrastructure trends; it is not company guidance.